Semiconductor test apparatus

ABSTRACT

A semiconductor test apparatus including a test apparatus body generating a test pattern supplied to a semiconductor device; a test head directly contacting the semiconductor device and supplying to the semiconductor device the generated test pattern; a cable passing the test pattern from the test apparatus body to the test head; a holding platform holding the test head in a movable manner; and a movable support section holding the cable, moving in a direction to release tension on a side closer to the test head than the test apparatus body in a case where tension arises in the cable because the test head moves on the holding platform, and moving in a direction to pull the cable on a side closer to the test head than the test apparatus body in a case where slack arises in the cable because the test head moves on the holding platform is provided.

CROSS REFERENCE TO RELATED APPLICATION

This is a continuation application of PCT/JP2005/10264 filed on Jun. 3,2005, the contents of which are incorporated herein by reference.

BACKGROUND

1. Technical Field

The present invention relates to a semiconductor test apparatus and,more particularly, the present invention relates to a semiconductor testapparatus in which a test head is held on a holding platform in amovable manner.

2. Related Art

A semiconductor test apparatus supplies a test pattern to asemiconductor device under test, receives an output signal output by thesemiconductor device based on the test pattern, and makes a judgmentconcerning pass/fail of the semiconductor device by comparing thereceived output signal to an expected value. A test apparatus body ofthe semiconductor test apparatus that generates the test pattern and theexpected value receives the output signal of the semiconductor deviceunder test and compares the received output signal to the expectedvalue. The semiconductor device under test is placed on a test head, andthe test apparatus body and the test head are connected via a connectioncable.

The test head internally includes a performance board corresponding to aterminal array of the semiconductor device under test and a pinelectronics substrate connecting the performance board to the connectioncable. The semiconductor device under test is automatically suppliedfrom a handler. In such a case, there is an upright handler thatattaches and removes the semiconductor device from the performance boardwith the performance board standing vertically. To attach or remove, andthereby replace, the semiconductor device on the performance board usingthe upright handler, orientation of the test head is changed. Then,after the semiconductor device is replaced, the orientation of the testhead is returned to the previous orientation and the semiconductordevice is tested.

In a case where the orientation of the test head is changed, tension isplaced on the connection cable connecting the test head to the testapparatus body by changing the orientation of the test head in relationto the test apparatus body, and therefore slackness occurs when thetension is released. In response to the aforementioned problem, asemiconductor test apparatus is provided with a movable support sectionthat holds the cable and moves in a direction of a release of tension ina case where tension is placed on the cable (see, e.g., Patent Document1).

Patent Document 1: International Publication WO2005/026753

The movable support section described in the aforementioned PatentDocument 1 moves downward in a case where tension is placed on theconnection cable and moves upward when tension is released. Accordingly,in a case where the movable support section moves upward or downward,both sides of the connection cable supported by the movable supportsection are equally pulled in a longitudinal direction. In such a case,by pulling the connection cable, a pulling force is placed on theconnected portion of the test apparatus body and the connection cable,resulting in a problem that the connected portion becomes separated.Furthermore, where the connection cable is lengthened to avoid placingthe pulling force on the connected section, there is a problem that adelay or degradation of the test signal occurs.

SUMMARY

Therefore, it is an object of an aspect of the present invention toprovide a semiconductor test apparatus, which is capable of overcomingthe above drawbacks accompanying the related art. The above and otherobjects can be achieved by combinations described in the independentclaims. The dependent claims define further advantageous and exemplarycombinations of the present invention.

According to a first aspect related to the innovations herein, oneexemplary apparatus may include a semiconductor test apparatus. Thesemiconductor test apparatus includes a test apparatus body thatgenerates a test pattern supplied to a semiconductor device; a test headthat directly contacts the semiconductor device and supplies to thesemiconductor device the test pattern generated by the test apparatusbody; a cable that passes the test pattern from the test apparatus bodyto the test head; a holding platform that holds the test head in amovable manner; and a movable support section that holds the cable,moves in a direction to release tension on a side closer to the testhead than the test apparatus body in a case where the tension arises inthe cable because the test head moves in relation to the holdingplatform, and moves in a direction to be pull the cable on a side closerto the test head than the test apparatus body in a case where slackarises in the cable because the test head moves toward the holdingplatform.

According to a second aspect related to the innovations herein, oneexemplary apparatus may include a semiconductor test apparatus. Thesemiconductor test apparatus includes a test apparatus body thatexecutes testing by supplying an electric signal to a semiconductordevice, a test head interposed between the semiconductor device and thetest apparatus body, a cable that electrically connects the testapparatus body to the test head, a holding platform that holds the testhead in a rotatable manner, and a movable support section that holds thecable. In the semiconductor test apparatus, the movable support sectionincludes a rotating arm that, in a case where slack arises in the cablebecause the test head rotates in relation to the holding platform,rotates to hold the cable in a manner to curve the slack upward.

The summary clause does not necessarily describe all necessary featuresof the embodiments of the present invention. The present invention mayalso be a sub-combination of the features described above. The above andother features and advantages of the present invention will become moreapparent from the following description of the embodiments taken inconjunction with the accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 shows a configuration of a semiconductor test apparatus 10according to an embodiment of the present invention.

FIG. 2 shows a test head 100 in a rotated condition to exchange a pinelectronics substrate.

FIG. 3 shows an exemplary detailed configuration of a movable supportsection 200.

FIG. 4 shows another example of a detailed configuration of the movablesupport section 200.

DESCRIPTION OF EXEMPLARY EMBODIMENTS

Hereinafter, an embodiment of the present invention will be described.The embodiment does not limit the invention according to the claims, andall the combinations of the features described in the embodiment are notnecessarily essential to means provided by aspects of the invention.

FIG. 1 shows a configuration of a semiconductor test apparatus 10according to an embodiment of the present invention. FIG. 2 shows a testhead 100 in a rotated condition. The semiconductor test apparatus 10 isprovided with a test apparatus body 300, the test head 100, a movablesupport section 200, a connection cable 400, a plurality of rollers 500,and a handler 600. The semiconductor test apparatus 10 of the presentinvention aims to prevent disconnection and stress added to theconnection cable 400 caused by rotation of the test head.

The test apparatus body 300 generates a test program supplied to asemiconductor device 106 under test. Furthermore, the test apparatusbody 300 receives an output signal output by the semiconductor device106 in response to the test pattern and makes a judgment concerningpass/fail of the semiconductor device 106 by comparing the receivedoutput signal to a predetermined value.

The connection cable 400 is connected to the test head 100 and the testapparatus body 300 and passes the test pattern from the test apparatusbody 300 to the test head 100. Furthermore, the connection cable 400passes the output signal output by the semiconductor device 106 inresponse to the test pattern from the test head 100 to the testapparatus body 300. The connection cable 400 is a bundle of severalhundred wires including fat power source cables and signal cables. Thereis a case where, for example, a flat cable is included in which aplurality of transmission lines, such as optical fibers, are arranged ina flat manner. Furthermore, according to a system configuration, thereis also a case where the connection cable 400 is a bundle containingseveral thousand of the aforementioned cables.

The test head 100 is provided with a plurality of pin electronicssubstrates and a device interface 108 connected to the pin electronicssubstrates. The device interface 108 is provided with a plurality of ICsockets 109 that electrically contact the semiconductor device 106. Thedevice interface 108 is mechanically positioned to be joined to thehandler 600. In such a joined condition, the semiconductor device 106 istransported inside the handler 600 and electrically connected to the ICsockets 109 to execute testing of the device. In a case where the typeof semiconductor device 106 tested by the test head 100 is changed, thedevice interface 108 may be replaced accordingly. Furthermore, thedevice interface 108 can also be attached or removed in a case where amaintenance operation is executed. Because of this, the test head 100 issupported by a holding platform 110 that can move horizontally and,furthermore, the test head 100 is structured in a manner to rotateapproximately ninety degrees.

In a case where the device interface 108 is replaced, the handler 600shown in FIG. 2 is caused to stand vertically such that a surfaceconnected to the test head 100 is on top. Therefore, the connectioncable 400 is pulled approximately 1 m, adding a stress of tension T.

The holding platform 110 is provided with wheels, not shown, on a bottomof the platform base 114 to allow movement and holds the test head 100in a movable manner. In the configuration shown in FIG. 1, the holdingplatform 110 includes a pair of holding arms 112 mounted on the platformbase 114. The pair of holding arms 112 axially supports the test head100 so that the test head 100 can be held by the holding platform 110 ina rotatable manner.

The plurality of rollers 500 causes the connection cable 400 to movesmoothly without stress and is disposed in a rotatable manner on anupper surface of the platform base 114 of the holding platform 110. Therollers 500 support the connection cable 400 from below. In a case wherethe connection cable 400 is moved by slackening or increasing of tensionon the connection cable 400, the rollers 500 supporting the connectioncable 400 roll together along with the movement of the connection cable400. Therefore, the rollers 500 can smoothly move the connection cable400.

The movable support section 200 causes the connection cable 400 to movesmoothly without stress and includes a platform base 208 joined with theplatform base 114, a rotating arm 204 supported on the platform base 208in a manner to be rotatable around a rotation axis 206, and a grippingsection 202 disposed on an end portion of the rotating arm 204 thatgrips the connection cable 400. Wheels, not shown, are also disposed ona bottom portion to allow movement. The rotating arm 204 has anappropriate elasticity with respect to the rotational direction suchthat the rotating arm 204 stands upright, as shown in FIG. 2, in acondition where tension is not placed on the connection cable 400. In acondition where the connection cable 400 is held, the movable supportsection 200 moves between the position shown in FIG. 1 and the positionshown in FIG. 2. The gripping section 202 may be a clip that sandwichesand holds the connection cable 400 or may be a clamp that sandwiches andholds the connection cable by the fastening force of a screw.

In a case where the test head 100 is in the condition shown in FIG. 1,the connected portion of the connection cable 400 connected to the testhead 100 is in a position separated from the test apparatus body 300, sothat the test head 100 pulls the connection cable 400. In such a case,the movable support section 200 moves in a direction to release thetension T on a side closer to the test head 100 than the test apparatusbody 300. In the configuration shown in FIG. 1, in a case where the testhead 100 pulls the connection cable 400, the gripping section 202 of themovable support section 200 is pulled to the left in the diagram by thetension T of the connection cable 400. Accordingly, the rotating arm 204joined to the gripping section 202 rotates in a direction of an arrow Ain the diagram around the rotation axis 206. Therefore, the grippingsection 202 moves toward the test head 100, thereby releasing thetension placed on the connection cable 400 on a side of the test head100. Here, it is desirable that the elasticity of the movable supportsection 200 in the axial direction be set to minimize the stress placedon the connection cable 400.

When the test head 100 rotates from the configuration shown in FIG. 1 tothe configuration shown in FIG. 2, slack arises in the connection cable400. When slack arises in the connection cable 400, there is a casewhere a portion of the connection cable 400 becomes heavy, causingbuckling, and thereby creating a large amount of stress that, whenrepeated, results in disconnection. However, as shown in FIG. 2, in acase where the test head 100 moves towards the holding platform 110together with the slackening of the connection cable 400, the movablesupport section 200 moves in a direction to pull the connection cable400 on a side closer to the test head 100 than the test apparatus body300. In such a case, because the pulling force placed on the connectioncable 400 by the gripping section 202 is released by the slackening ofthe connection cable 400, the rotating arm 204 joined to the grippingsection 202 rotates in a direction B in the diagram around the rotationaxis 206. Accordingly, the gripping section 202 moves toward the testapparatus body 300, so that the slackened portion of the connectioncable 400, which is the portion of the connection cable 400 on the sideof the test head 100, is pulled by the movable support section 200.Therefore, buckling of the connection cable 400 can be prevented.Accordingly, disconnection of the connection cable 400 can be prevented.Furthermore, because the portion of the connection cable 400 on the sideof the test head 100 is pulled, a burden placed on a connection point ofthe connection cable 400 and the test apparatus body 300 can beprevented. Yet further, deterioration of the connection cable 400 can beprevented.

On the other hand, where the test head 100 rotates from the conditionshown in FIG. 2 to the condition shown in FIG. 1, an aperture 104returns to a previous downward orientation. In such a case, theconnection cable 400 is pulled by the test head 100 as the test head 100rotates. Therefore, the tension T is placed on the connection cable 400.In a case where the tension T is placed on the connection cable 400because the test head 100 moves in relation to the holding platform 110,the gripping section 202 of the movable support section 200 is pulled tothe left in FIG. 1 by the tension T of the connection cable 400.Accordingly, the rotating arm 204 joined to the gripping section 202rotates in a direction of the arrow A of FIG. 1 around the rotation axis206. Therefore, the gripping section 202 moves toward the test head 100,thereby releasing the tension placed on the connection cable 400 on aside of the test head 100. Accordingly, disconnection of the connectioncable 400 caused by an excessive tension can be prevented. Because thetension of the connection cable 400 on the side of the test head 100 isreleased, the burden placed on the connection point of the connectioncable 400 and the test apparatus body 300 can be prevented.

In the embodiment shown in FIG. 1 and FIG. 2, the holding platform 110holds the test head 100 in a rotatable manner, but is not limited tosuch. For example, in a case where the handler 600 can movehorizontally, the holding platform 110 may be structured without wheelsfor moving. As another example, the holding platform 110 may hold thetest head in a manner such that the test head 100 can be raised andlowered. In such a case, slack arising in the connection cable 400 canbe prevented because the rotating arm 204 rotates toward the testapparatus body 300 at a time when the test head 100 is raised inrelation to the test apparatus body 300, and furthermore, tension placedon the connection cable 400 can be released because the rotating arm 204rotates toward the test head 100 at a time when the test head 100 islowered in relation to the test apparatus body 300.

FIG. 3 shows an exemplary detailed configuration of the movable supportsection 200. The movable support section 200 includes the platform base208, the rotation axis 206, the rotating arm 204, and the grippingsection 202. Furthermore, the movable support section 202 includes aspring 210 disposed around the rotation axis 206 and a locking piece 202projecting inside the platform base 208. The spring 210 causes therotating arm 204 to be biased in a direction of the arrow B in thediagram. The locking piece 202 directly contacts a portion of therotating arm 204 when the rotating arm 204 is in a position standingvertically and prohibits the rotating arm 204 from rotating further fromthe aforementioned position in a direction of the arrow B.

In the configuration shown in FIG. 3, in a case where the connectioncable 400 gripped by the gripping section 202 is pulled by a tension T,the spring force of the spring 210 is set to be slightly less than thetorque arising from the above case. Therefore, in a case where the testhead 100 pulls the connection cable 400 with a tension T, the rotatingarm 204 can rotate in a direction of the arrow A against the springforce of the spring 210. On the other hand, in a case where theconnection cable 400 slackens, the rotating arm 204 is moved in adirection of the arrow B by the spring force of the spring 210 and stopsat a position where the rotating arm 204 contacts the locking piece 204.As a result, the stress placed on the connection cable 400 issignificantly reduced. Here, it is desirable that the spring be providedwith an adjustment mechanism that adjusts the spring force of the spring210 to minimize stress placed on the connection cable 400. Therefore,the appropriate spring force can be provided for different cable weightsin the system configuration.

FIG. 4 shows another example of a detailed configuration of the movablesupport section 200. The movable support section 200 of FIG. 4 includesthe platform base 208, the rotation axis 206, the 204, and the grippingsection 202 in the same manner as the configuration of FIG. 3.Furthermore, the movable support section 400 of FIG. 4 includes an aircylinder apparatus 220 disposed between a floor or the like and therotating arm 204. The air cylinder apparatus 220 includes a vacuumcylinder section 224 and a piston rod 222 that is inserted into thevacuum portion of the cylinder section 224 and slides in the cylindersection 224 in a direction of the arrow C in the diagram. In the aircylinder apparatus 220, the piston rod 222 is driven by pressure of gasinjected into the cylinder section 224. In the present embodiment, thegas injected into the cylinder section 224 is dry air, for example.

The pressure of the gas in the cylinder section 224 is set to be, forexample, less than the pressure supplied by the piston rod 222 to thegas in the cylinder section 224 according to a load placed on thegripping section 202 in a case where the connection cable 400 is mostslackened and the piston rod 222 is raised to a highest point within amoveable range of the piston rod 222 and greater than the pressuresupplied by the piston rod 222 to the gas in the cylinder section 224according to a load placed on the gripping section 202 in a case wherethe connection cable 400 is least slackened and the piston rod 222 islowered to a lowest point within the moveable range of the piston rod222. It is desirable that the pressure of the gas in the cylindersection 224 be set such that an average value of the pressure suppliedto the gas in the cylinder section 224 by the piston rod 222 in a casewhere the piston rod 222 is raised to the highest point be roughly equalto the pressure supplied to the gas in the cylinder section 224 by thepiston rod 222 in a case where the piston rod 222 is lowered to thelowest point.

Through the configuration described above, in the same manner as theconfiguration shown in FIG. 3, the movable support section 200 of FIG. 4can move the gripping section 202 in a direction of the arrow A in acase where the connection cable 400 is pulled by the test head 100 andcan move the gripping section 202 in a direction of the arrow B in acase where the connection cable 400 is slackened. As a result, thestress placed on the connection cable 400 is significantly reduced.

As another example, a hydraulic driving apparatus that drives the pistonrod by injected oil may be used in place of the air cylinder apparatus220. As a further example, a spring or a gas spring that achieves aneffect of a spring by using a repulsive force of gas sealed in thecylinder section may be used.

As made clear from the above description, through the semiconductor testapparatus 10 according to the present embodiment, a slackened portion ofthe connection cable 400 can be held without placing a burden on thesection connected to the test apparatus body 300 in a case where slackarises in the connection cable 400 connecting the test head 100 to thetest apparatus body 300, and furthermore, tension placed on theconnection cable 400 can be released without placing a burden on thesection connected to the test apparatus body 300 in a case where tensionis placed on the connection cable 400.

While the embodiment of the present invention has been described, thetechnical scope of the invention is not limited to the above describedembodiment. It is apparent to persons skilled in the art that variousalterations and improvements can be added to the above-describedembodiment. It is also apparent from the scope of the claims that theembodiments added with such alterations or improvements can be includedin the technical scope of the invention.

As made clear from the above description, through an embodiment of thepresent invention, a semiconductor test apparatus is realized that canappropriately hold a connection cable without disconnection in a casewhere slack arises in the connection cable connecting a test apparatusbody and a test head.

1. A semiconductor test apparatus, comprising: a test apparatus bodythat generates a test pattern supplied to a semiconductor device; a testhead that directly contacts the semiconductor device and supplies to thesemiconductor device the test pattern generated by the test apparatusbody; a cable that passes the test pattern from the test apparatus bodyto the test head; a holding platform that holds the test head in amovable manner; and a movable support section that holds the cable,moves in a direction to release tension on a side closer to the testhead than the test apparatus body in a case where the tension arises inthe cable because the test head moves in relation to the holdingplatform, and moves in a direction to be pull the cable on a side closerto the test head than the test apparatus body in a case where slackarises in the cable because the test head moves toward the holdingplatform.
 2. The semiconductor test apparatus according to claim 1,wherein the holding platform holds the test head in a rotatable manner.3. The semiconductor test apparatus according to claim 1, wherein theholding platform holds the test head in a manner such that the test headcan be brought near to or separated from the test apparatus body.
 4. Thesemiconductor test apparatus according to claim 1, wherein the holdingplatform holds the test head in a manner such that the test head can beraised or lowered.
 5. The semiconductor test apparatus according toclaim 1, wherein the movable support section includes a gripping sectionthat grips the cable, rotates the gripping section toward the testapparatus in a case where tension arises in the cable, and rotates thegripping section toward the test head in a case where slack arises inthe cable.
 6. The semiconductor test apparatus according to claim 1,further comprising a roller that is arranged beneath the holdingplatform, supports the cable, and rotates along with movement of thecable.
 7. A semiconductor test apparatus, comprising: a test apparatusbody that executes testing by supplying an electric signal to asemiconductor device; a test head interposed between the semiconductordevice and the test apparatus body; a cable that electrically connectsthe test apparatus body to the test head; a holding platform that holdsthe test head in a rotatable manner; and a movable support section thatholds the cable, wherein the movable support section includes a rotatingarm that, in a case where slack arises in the cable because the testhead rotates in relation to the holding platform, rotates to hold thecable in a manner to curve the slack upward.